The Build-Up Substrate Symposium is sponsored by the Santa Clara Valley Chapter of the IEEE’s Electronics Packaging Society.
We invite your company or institution to become a Sponsor!Process your sponsorship on our registration websiteRegister yourself as the contact person; then, under “Registration Fee”, choose your level of sponsorship. To receive a pro forma invoice, or to arrange another payment method, contact Paul Wesling Your donation to the IEEE for BUSS helps to defray facility and food expenses, travel reimbursements for key speakers, and other costs that aren’t covered by attendee registration. Please contact Dr. Annette Teng, our Sponsor Relations Chair, about making a contribution through our Symposium treasurer. Platinum Sponsor: $2,500 Gold Sponsor: $2,000 Silver Sponsor: $1,500 |
Platinum Sponsors: Gold Sponsor: Silver Sponsor: 2024 SPONSORS: |
