We invite you to contact any of our Symposium officers/volunteers.
![]() General Chair Habib Hichri Executive VP, Ajinomoto Fine Techno USA Corp (more …) |
![]() Sponsor Relations Annette Teng Director of Package Integration, AIM Photonics, TAP Facilities (more …) |
![]() Treasurer Azmat Malik Accuventures (more …) |
![]() Administration Paul Wesling HP (retired) (more …) |
Program Team |
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![]() Program Committee Rozalia Beica Field CTO Packaging Technologies, Rapidus Design Solutions, Rapidus (more …) |
![]() Program Committee Jan Vardaman Techsearch International (more …) |
![]() Program Committee Venky Sundaram Founder, 3DSystemScaling (more …) |
![]() Program Committee Kuldip Johal Global OEM Director, MKS Instruments, Inc. (more …) |
![]() Program Committee Matt Kelly CTO & VP Technology Solutions, IPC (more …) |
![]() Program Committee Farhang Yazdani President & CTO, Broadpak (more …) |
![]() Program Committee Steven Verhaverbeke Applied Materials (more …) |
![]() Program Committee Yoji Nakajima Director of Technology, Tokyo Electron America, Inc (more …) |