The Build-Up Substrate Symposium is sponsored by the Santa Clara Valley Chapter of the IEEE’s Electronics Packaging Society.
We invite your company or institution to become a Sponsor!
Process your sponsorship on our registration website
Register yourself as the contact person; then, under “Registration Fee”, choose your level of sponsorship. To receive a pro forma invoice, or to arrange another payment method, contact Paul Wesling
Your donation to the IEEE for BUSS helps to defray facility and food expenses, travel reimbursements for key speakers, and other costs that aren’t covered by attendee registration. Please contact Dr. Annette Teng, our Sponsor Relations Chair, about making a contribution through our Symposium treasurer.
Platinum Sponsor: $2,500
— Includes your logo on our website and publicity
— Recognition in our on-site presentations
— A “prime location” tabletop space for your literature
— Up to six complimentary on-site admissions
Gold Sponsor: $2,000
— Includes your logo on our website and publicity
— Recognition in our on-site presentations
— A tabletop space for your literature
— Up to four complimentary on-site admissions
Silver Sponsor: $1,500
— Includes your logo on our website and publicity
— Recognition in our on-site presentations
— A tabletop space for your literature
— Up to two complimentary on-site admissions