Devices for Integrated Circuit (DevIC 2025)

Abstract:

The field of VLSI design and device simulation has witnessed transformative growth, driven by the demands for higher performance, lower power consumption, and the integration of AI, IoT, and 5G technologies. This special session aims to bring together researchers and industry professionals to present their latest advances and breakthroughs. The session will focus on novel methodologies, innovative designs, and optimization techniques that address the challenges of modern electronics. Researchers are invited to submit their novel research and unpublished work to this special session.

Topics:

Device Modelling & Simulation, Low-power devices for circuit applications, Devices with Low temperature processing, Devices with New material systems, Devices for Low power applications, Low dimensional devices, Design and Simulation of Circuits with nanoscale devices, CMOS Processes, Devices and Integration, VLSI based System design, Machine learning in devices, MEMS, nano-sensors, RF Microelectronics, etc.

Special Session chair(s):

Dr Neeraj Gupta
Amity University Haryana
M.No. 9896537008
e-mail: neerajsingla007@gmail.com

Dr. Prashant Kumar
JC Bose University of Science & Technology, YMCA Faridabad
M.No. 9968540450
e-mail: pk.vlsi@gmail.com

Dr. Rashmi Gupta
Amity University Haryana
M.No. 8901502059
e-mail: goyal.rashmi18@gmail.com

Abstract:

Artificial Intelligence (AI) and Machine Learning (ML) have numerous applications in Electronics and Communication Engineering, transforming the field in various ways:

VLSI Design Applications

1. Logic Synthesis: AI-powered logic synthesis can optimize digital circuit designs for area, power, and performance.
2. Physical Design: ML algorithms can be used to optimize physical design, including placement, routing, and timing closure.

• Fault Detection and Diagnosis: AI-powered systems can quickly identify and diagnose faults in VLSI designs, reducing debug time and costs.

1. Power Optimization: ML algorithms can be used to optimize power consumption in VLSI designs, reducing heat dissipation and increasing battery life.

Embedded Systems Design Applications

1. System-on-Chip (SoC) Design: AI-powered SoC design can optimize system architecture, reducing power consumption and increasing performance.
2. Real-Time Operating System (RTOS) Optimization: ML algorithms can be used to optimize RTOS scheduling, reducing latency and increasing system responsiveness.

• Embedded Software Development: AI-powered tools can aid in embedded software development, including code generation, testing, and debugging.

1. Predictive Maintenance: AI-powered predictive maintenance can be used to predict and prevent failures in embedded systems, reducing downtime and increasing overall efficiency.

Electronics Engineering Applications

1. Predictive Maintenance: AI-powered predictive maintenance helps forecast equipment failures, reducing downtime and increasing overall efficiency.
2. Quality Control: ML algorithms can be trained to detect defects in electronic components, improving quality control and reducing waste.

• Design Automation: AI can aid in the design of electronic circuits and systems, optimizing performance, power consumption, and area.

1. Fault Detection and Diagnosis: AI-powered systems can quickly identify and diagnose faults in electronic systems, reducing repair time and costs.

Communication Engineering Applications

1. Channel Estimation and Equalization: ML algorithms can improve channel estimation and equalization in wireless communication systems, enhancing data transmission rates and reliability.
2. Resource Allocation: AI can optimize resource allocation in wireless networks, improving network efficiency, capacity, and user experience.

• Network Security: AI-powered systems can detect and prevent cyber threats in communication networks, ensuring secure data transmission.

1. Signal Processing: ML algorithms can be applied to various signal processing tasks, such as filtering, modulation classification, and signal detection.

Topics:

1. Signal and Image Processing
2. VLSI and Embedded Systems Design
3. IoT
4. Electronic Devices
5. Communications

Special Session chair(s):

Dr. Jami Venkata Suman

Assistant Professor, Department of ECE

GMR Institute of Technology, GMR Nagar, Rajam, Andhra Pradesh, India

Email: venkatasuman.j@gmrit.edu.in, jami.venkatasuman@gmail.com

Aim and Scope:

Intelligent communication has emerged as one of the most prominent technologies in the domains of wireless communications and mobile computing over the last decade. The wireless communication paradigm, which evolved from fundamental communication, has transformed every aspect of human life, including health care, vehicular communication, and the Internet of Things. This issue is looking for high-quality research articles and reviews on cutting-edge wireless communications and mobile computing technologies that contribute to the development and advancement of intelligent technologies. This special issue will also cover research topics such as 5G wireless technology, microwave communication, antenna design, and computing with IoT, IoT security and trust, IoT and personal data protection, artificial intelligence, IoT interoperability, and multi-platform integration.

Keywords:

Intelligent communication, Internet of things, multiplatform integration, Next generation computing, Wireless communication.

Special Session chair(s):

Abstract:

The future of systems design will be marked by the convergence of multiple technologies that enhance automation, intelligence, and efficiency. This track broadly encompasses the various areas, including computational intelligence, AI, embedded systems, machine learning, communication systems, and advanced sensing technologies like radar and microwaves, while also hinting at new paradigms in the field. Researchers from academia and industries are invited to submit their novel research and unpublished work to this special session.

Topics:

Computational intelligence and electronic systems, Hardware-based deep learning Artificial Intelligence, Embedded architectures, system design with Artificial Intelligence and Machine Learning, Machine intelligence, Flexible and Wearable devices, Devices/circuits/systems used in Microwave & Antenna Technologies, Communication Systems & Signal Processing, advanced radar sensing and imaging, New Communication Paradigms

Special Session chair(s):

Overview:

The rapid evolution of semiconductor technologies in Integrated has become an anchor for innovation in Communication, Computing, Embedded Systems, and IoT. The increasing complexity and functionality of next-generation devices demand advanced semiconductor solutions that integrate cutting-edge process protocols, energy-efficient architectures, and intelligent features powered by Machine Learning (ML) and Artificial Intelligence (AI). This special session aims to bring together researchers, industry experts, and academicians to discuss breakthroughs in semiconductor technologies and their transformative impact on upcoming devices. By focusing on both foundational semiconductor advancements and their application to modern challenges, this session will foster dialogue on developing innovative solutions to meet the needs of dynamic fields such as IoT, Communication, and AI-driven applications.

Scope of the Session:

This session will cover, but not be limited to, the following topics: 1. Semiconductor Technology Development: o Advanced materials and processes for low-power and high-performance devices o Emerging semiconductor architectures for IT and Communication sectors o Challenges in scaling and 3D IC integration 2. Embedded Systems and IoT Applications: o Energy-efficient semiconductors for IoT devices o Real-time processing solutions for embedded systems o Security-enhanced hardware for IoT networks 3. Communication Systems: o High-speed semiconductor solutions for 5G/6G networks o RF and microwave semiconductor devices for advanced communication protocols o Chip-level innovations to improve communication latency and bandwidth 4. Machine Learning and AI in Semiconductor Design: o AI-optimized design and fabrication processes o On-chip AI accelerators for real-time processing o Predictive maintenance and diagnostics using ML in semiconductor manufacturing 5. Next-Generation Device Prototypes and Standards: o Semiconductor standards for upcoming device interoperability o Application of semiconductor technologies in autonomous systems o Prototypes showcasing the convergence of IoT, AI, and Communication

Objectives:

The session will:

• • Highlight the latest advancements in semiconductor processes and architectures.
  • Explore applications of AI and ML in semiconductor technologies and their role in enhancing device performance.
  • Discuss challenges and opportunities in developing semiconductor solutions for emerging fields like IoT and 5G/6G communication.
  • Facilitate collaboration between academia and industry to accelerate innovation in semiconductor technologies.

Expected Outcomes:

• • Enhanced understanding of the state-of-the-art semiconductor technologies and their integration into modern devices.
  • Identification of key research areas and collaboration opportunities in semiconductor design and AI/ML.
  • Insights into future device requirements and semiconductor solutions for Communication, IT, Embedded, and IoT sectors.

Special Session Chairs:

Dr. Rashmi Gupta
Amity University Haryana Gurugram, Haryana (INDIA)
email :goyal.rashmi18@gmail.com

Dr. Lalit Rai
J. C. Bose University of Science and Technology,
YMCA Faridabad, Haryana (INDIA)
email: lalitmohanrai@gmail.com