EIC 2020 VIRTUAL EVENT IS CLOSED
The Organizing Committee and the Board of Governors welcome you to the 38th Electrical Insulation Conference, a fully sponsored conference of the IEEE Dielectric and Electrical Insulation Society (DEIS).
When you access the Virtual Event page, a password is requested, use the password provided in the e-mail from registration, type in and navigate in the Virtual event. Click on the bars on the TOP LEFT of the Virtual event section to see all the MENU options you have to look for your favorite session, title, author or just to sort them in alphabetical order.
This year, the conference received over 200 abstracts from all over the world. We had accepted 159 papers for the face-to-face event. Changing gears into a virtual event, the final number of papers for those who were supportive of this decision reached 129 total. EIC 2020 will include 14 sessions for a total of 84 oral presentations and 3 sessions for a total of 44 poster presentations.
On behalf of the EIC 2020 Organizing Committee I want to thank the companies who decided to sponsor the Virtual Event. We greatly appreciate your support and hope to see you next year at EIC 2021.
For this virtual event, we have prepared a well-organized website where authors of a registered paper and registered attendees have access to all 17 sessions for two consecutive weeks starting June 22 until July 03, 2020.
Again, thanks to all of you for attending this year’s virtual event and welcome to the 38th Electrical Insulation Conference Virtual Event.
Dr. Diego Robalino
General Conference Chair
38th Electrical Insulation Conference
If you have any question, please contact the EIC 2020 Organizing Committee ieee-eic2020@conftool.org for more information.