Plenary Speaker

Flexible Electronic Skin for Robotics and Interactive Systems

Ravinder Dahiya

Glasgow University, UK

Abstract: The miniaturization based advanced in electronics have revolutionized computing and communication during last more than half a century. However, these advances have mainly come through high-performance electronics on planar and stiff substrates. This is insufficient for several emerging applications and interactive systems (e.g., robots, wearables and vehicles etc.) which require sensors and electronics embedded in soft and squishy materials and in flexible form factors. These requirements call for new methods to realize electronics on unconventional substrates such as plastic, paper and elastomers. In this regard, resource efficient high-performance printed electronics has also added new dimension. This talk will present some of these advances, including hybrid integration of off-the-shelf devices embedded in soft materials, printed nanostructures, and ultra-thin chips, etc., leading to electronic skin for robotics, prosthetics and similar interactive systems. Such systems are also the key enablers for advances in emerging fields such as wearables, and healthcare technologies, and this lecture will also briefly discuss these potential future directions.

Biography: Ravinder Dahiya is Professor of Electronics and Nanoengineering and EPSRC Research Fellow in the James Watt School of Engineering at University of Glasgow. His group (Bendable Electronics and Sensing Technologies (BEST)) conducts fundamental research in flexible printed electronics, electronic skin, and their application in robotics, prosthetics, and wearables. Prof. Dahiya has authored or co-authored more than 400 publications, books and submitted/granted patents and disclosures. He has led or contributed to many international projects.

Prof. Dahiya is President of IEEE Sensors Council. He is the Founding Editor-in-Chief of IEEE Journal on Flexible Electronics (J-FLEX). He is also the founder of IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS). Prof. Dahiya has received several awards, including Technical Achievement award from IEEE Sensors Council, Young Investigator Award from Elsevier, and 11 best journal/conference paper awards as author/co-author. Prof. Dahiya is Fellow of IEEE and the Royal Society of Edinburgh.