Flexible inorganic substrates for electronic device integration
Corning, USA
Abstract: Fabrication of electronic devices on flexible substrates is attracting increasing interest for many applications, such as electronics, optoelectronic displays, sensors. Some of the applications require substrate attributes with optical & surface quality, dimensional & thermal stability and hermeticity which can be difficult for polymer and metal materials. Corning has multiple flexible substrate options for new device design, functionality and integration including flexible glass (Corning® Willow® Glass) and ultra-thin ceramics (Corning Ribbon Ceramics). Corning’s proprietary continuous forming/sintering processes produce high quality inorganic substrates compatible with both sheet and R2R manufacturing. In this talk, we will give an overview on these flexible substrates and its applications.
Biography: Dr. ChengGang (CG) Zhuang is a project manager in inorganic material research at Corning Incorporated. He obtained his PhD in physics from Peking University and postdoctoral training at the Penn State University. He held a research assistant professor position in physics department at Temple University before joining Corning in 2011. He has over 10 years of new growth innovation project experience in Energy Storage, Clean Energy, Clean Air, Architecture and Electronics with advanced glass and ceramics. His most recent research focus is application discovery of Corning® Ribbon Ceramics, a new platform technology making thin, flexible high-quality ceramic substrates. Dr. Zhuang has published over 50 peer reviewed papers, 17 patent applications.