Steering Committee

Fernando Guarin, IEEE EDS Sr. Past President

Ravi Todi, IEEE EDS President

Bin Zhao, IEEE EDS President Elect

Kazunari Ishimaru, IEEE EDS VP Meetings

Arokia Nathan, IEEE EDS VP Publications and Products, General Chair

Samar Saha, IEEE EDS Past President, Co-General Chair

Xiaojun Guo, IEEE EDS Board of Governors Member-at-Large, TPC Chair

Ta-Ya Chu, IEEE EDS Flexible Electronics and Displays Comm Chair

 

Organizing Committee

Arokia Nathan, General Chair, Shandong University, China

Ling Li, Co-General Chair,Institute of Microelectronics, CAS, China

Yong Lian, Co-General Chair, Shanghai Jiao Tong University, China

Samar Saha, Co-General Chair, Prospicient Devices, CA, USA

Xiaojun Guo, TPC Chair, Shanghai Jiao Tong University, China

Andrew Flewitt, TPC Co-Chair, Cambridge University, UK

Woo Soo Kim, TPC Co-Chair, Simon Fraser University, Canada

Kai Wang, TPC Co-Chair, Sun-yat Sen University, China

Gangqiang Yang, Publications Chair, Shandong University, China

Susthitha Menon, Publications Co-Chair, UKM, Malaysia

Mengwei Si, Publicity Chair, Shanghai Jiao Tong University, China

Camilo Velez Cuervo,Publicity Co-Chair,IEEE EDS

Jun Yu, Local Arrangements Chair, Shandong University, China

 

Technical Program Committee

Subcommittee: Materials, Devices and Processing (MDP)

Chairs: Radu Sporea, University of Surrey, UK; Hang Zhou, Peking University Shenzhen Graduate School, China

Myung-Gil Kim, Sungkyunkwan University, Korea

Yuanyuan Hu, Hunan University, China

Luisa Petti, Free University of Bozen-Bolzano, Italy

Dimitra Georgiadou, University of Southampton, UK

Benjamin C. K. Tee, National University of Singapore, Singapore

Sean M Garner, Corning, USA

Jie Zhang, Jiangnan University, China

Xiang Chen, Nanjing University of Science & Technology, China

 

Subcommittee: Energy Harvesting and Storage (EHS)

Chairs: Junliang Yang, Central South University, China; Tse Nga Ng, University of California, San Diego, USA

Sushmee Badhulika, Indian Institute of Technology Hyderabad, India

Jianmin Ma, University of Electronic Science and Technology of China, China

Changqi Ma, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, China

Caiyun Wang, University of Wollongong, Australia

Tricia Breen Carmichael, University of Winsor, Canada

Jong Hyun Kim, Ajou University, Korea

 

Subcommittee: Emissive and Reflective Displays (ERD)

Chairs: Paul Boru Yang, Sun Yat-sen University, China; Yongtaek Hong, Seoul National University, Korea

Miao Xu, Guangzhou New Vision Optoelectronics, China

Chaoyu Xiang, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, China

Paul Cain, FlexEnable, UK

Norihisa Kobayash, Chiba University, JP

Qijun Yao, Tianma, China

Haohui Long, Huawei, China

 

Subcommittee: Sensors, Actuators and Bioelectronics (SAB)

Chairs: Cunjiang Yu, Pennsylvania State University, USA; Feng Yan, Hong Kong Polytech University, China

Weidong Zhou, The University of Texas at Arlington, USA

Pedro Estrela, University of Bath, UK

Ying Fu, University of Strathclyde, UK

Shiming Zhang, University of Hong Kong, China

Liang Li, Hefei Institutes of Physical Science, Chinese Academy of Sciences, China

Zhengchun Peng, Shenzhen University, China

 

Subcommittee: Circuits and Systems (CAS)

Chairs: Xueqing Li, Tsinghua University , China; Kai Ni, Rochester Institute of Technology, USA

Geng Di, Institute of Microelectronics, Chinese Academy of Sciences, China

Xiao Gong, National University of Singapore, Singapore

Xiang Cheng, Cambridge Touch Technologies Ltd, UK

Denis Striakhilev, Ignis Innovation Inc., Canada

Jian Zhao, Shanghai Jiao Tong University, China

 

Subcommittee: Emerging Applications (EAP)

Chairs: Hanbin Ma, SIBET-CAS, China; Niels Benson, University of Duisburg – Essen, Germany

Chen Jiang, Tsinghua University, China

AHM Zahirul Alam, International Islamic University Malaysia, Malaysia

Simon Ogier, SmartKem, UK

Piero Cosseddu, Università die Cagliari, Italy

Thomas Weitz, University of Göttingen, Germany

Linrun Feng, LinkZill, China

Dashan Shang, Insitute of Microelectronics, CAS, China