Ravi M. Todi received his doctoral degree in electrical engineering from university of central Florida (UCF), Orlando – Florida. His graduate research work was focused on gate stack engineering, with emphasis on binary metal alloys as gate electrode and on high mobility germanium channel devices. In his early career as, advisory engineer/scientist at semiconductor research and development center (SRDC) at IBM microelectronics division his work was focused on high performance embedded dynamic random access memory (eDRAM) integration on 45nm silicon on insulator (SOI) logic platform. For his many contributions to the success of eDRAM program at IBM, Ravi was awarded IBM’s prestigious outstanding technical achievement award. In 2012 Ravi Joined Qualcomm for 20nm product development and foundry management, responsible for Qualcomm’s foundry engagement with leading foundries. In 2015, he joined GLOBALFOUNDRIES, as director of 14nm product line management, where he and his team were responsible for driving the technical and business results of the 14nm FinFET product offerings. Currently he is with Western Digital as Sr. Technologist responsible for foundry technology development for global ASICs.
With over 60 US granted patents, over 30 peer reviewed journal publications, over 40 international conference presentations and over 50 invited distinguished lectures, Ravi is well known in semiconductor industry as technical/business leader. He is a distinguish lecturer for IEEE electron devices society and serves as an editor for IEEE transactions on electron devices. He has served as an IEEE EDS officer-Treasurer for four years, as elected board of governors’ member, as vice president for technical activities and conferences. Currently he is the president elect for IEEE EDS.
Semiconductor Industry: A story of unprecedented growth, and we are just getting started!
- ABSTRACT
Many have argued that the golden era of semiconductor technology scaling has ended, however in this presentation I will attempt to present the counter arguments. For the semiconductor industry, connectivity (5G), the Internet of Things (IoT) and high bandwidth data processing now promise to be the enablers for the next phase of growth. However, the industry has reached a new level of maturity that demands new innovations in computing, connectivity, system integration and ultra-low power applications. Although traditional Moore’s Law scaling remains important, the complexity of this next inflection point requires a new perspective on silicon scaling. Changing market demands are also driving innovation in differentiated technologies and system-level integration approaches that will be combined with silicon technology scaling. This presentation will examine the economic trends reshaping the industry and explore the technology directions that can successfully produce the needed innovations. We will draw lessons from five decades of semiconductor industry, dive deep into technical challenges facing future technology scaling, and attempt to formulate a roadmap for next decade of silicon technology.
