IEEE Hybrid Bonding Symposium
Theme: Enabling Hybrid Bonding Commercialization
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January 16-17, 2025, hosted by SEMI International, Silicon Valley, CA USA Note: HBS’25 is a hybrid event, with both in-person and virtual participation via WebEx. Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Download the Final Program Flyer!Registration is now open — on-site seating is limited. SIGN UP TODAY!
Confirmed Presentations at HBS’25: (partial list – see full listing) |
“The overall market is set to triple to US $38 billion by 2029.” Gabriella Pereira, Yole Group “Today there is a lot of development in silicon-to-silicon wafers, but we are also looking to do hybrid bonding between gallium nitride and silicon wafers and glass wafers … everything on everything.” Jean-Charles Souriau, CEA Leti Platinum SponsorsGold Sponsors Silver Sponsors |
