Hybrid Bonding Symposium

January 16-17, 2025, hosted by SEMI International, Silicon Valley, CA USA

Note: HBS’25 is planned as a hybrid event, with both in-person and virtual participation via WebEx.

Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.

Download the Call for Presentations

Confirmed Speakers at HBS’25: (Please submit your proposed presentation)

Hybrid Bonding Process Technology Guilian Gao, 3D Packaging, Adeia		Hybrid Bonding Innovations: Ultra-Low-Temperature Cu-Cu Bonding Based Passivation Technology and HRDL Platform Development for RDL Interposer Applications Prof. Kuan-Neng Chen, NYCU
Planarization for Advanced Packaging and Hybrid Bonding Brian J. Brown, VP-Engineering, Advanced Materials		Permanent and Temporary Wafer Bonding Viorel Dragoi, EV Group
Die to Wafer Hybrid Bonding for Direct Copper Interconnection Jonathan Abdilla, BESI		Characterization, Modelling and Reliability for Direct Copper Interconnection Dongkai Shangguan, Thermal Engineering Associates
Materials for Hybrid Bonding Andrea Chacko, Brewer Science