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January 16-17, 2025, hosted by SEMI International, Silicon Valley, CA USA
Note: HBS’25 is a hybrid event, with both in-person and virtual participation via WebEx.
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
Registration is now open — on-site seating is limited. SIGN UP TODAY! (Early-bird rates)
| Symposium Technical Areas: |
Hybrid Bonding Process Technology
• Process fundamentals
• Process characterization
• Process simulation and modeling
• Process optimization
• Metrology, quality control, and test/KGD
Materials for Hybrid Bonding
• Copper electrodeposition
• Inorganic and polymeric dielectrics
Application Areas
• Memory, Compute, CMOS, Photonics, MEMS
• Heterogeneous integration |
Equipment Technologies and Platforms
• Planarization for Hybrid Bonding
• Die to wafer bonding
• Wafer to wafer bonding
Design for Hybrid Bonding and Chiplets
• Design considerations and EDA tools
• Thermal management for advanced 3DIC systems
• Performance characterization (electrical, thermal) of Hybrid Bonding interconnects
• Reliability Test, KGD sorting for Hybrid Bonding
• Applications of Hybrid Bonding and chiplets for heterogeneous integration |
Confirmed Presentations at HBS’25: (partial list – see full listing)
Hybrid Bonding Processes and Materials
— “Hybrid Bonding Process Technology” (Adeia)
— “Fine-pitch Chip-to-Wafer Hybrid Bonding” (Tohoku University)
— “Deep Pitch Scaling of Wafer-to-wafer and Die-to-wafer Cu/SiCN Hybrid Bonding” (imec)
— “Low-Temp & Fine-Pitch Wafer-to-Wafer Hybrid Bonding Using Nanotwinned and Nanocrystalline Copper” (ITRI)
— “Investigation of Materials and Processes for Polymer-Based Hybrid Bonding” (Toray)
— “Hybrid Bonding Innovations” (NYCU)
Hybrid Bonding Applications
— “How Did the “Hybrid Bonding” Technology Become Reliable?” (CEA-Leti)
— “Yield Modeling for Hybrid Bonding” (UCLA)
— “Process Control for Hybrid Bonding Applications” (Onto Innovation)
— “Advanced 3D Stacking Process with Hybrid Bonding Technology for CMOS Image Sensors” (Sony)
Hybrid Bonding Metrology
— “Advanced 3D Imaging Technologies for 3D IC Packages” (Sigray)
— “Acoustic Inline Metrology for Hybrid Bonding” (PVA)
— “Metrology for Hybrid Bonds, Microbumps and TSVs in Advanced Packaging” (Excillum)
— “Non-Contact Measurement of Thermal Contact Resistance Using Lock-in Thermography” (Nagoya University)
… and more – Plan to attend! |
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“The overall market is set to triple to US $38 billion by 2029.”
Gabriella Pereira, Yole Group
“Today there is a lot of development in silicon-to-silicon wafers, but we are also looking to do hybrid bonding between gallium nitride and silicon wafers and glass wafers … everything on everything.”
Jean-Charles Souriau, CEA Leti
Gold Sponsors
Adeia
Sigray
EV Group
Silver Sponsors
Brewer Science
BESI
SCV Chapter, Electronics Packaging Society |
