Special Invited Sessions

Special invited sessions will be arranged on August 13th and 14th.


We have 7 Special Session Topics including E-Textiles, Stretchable, Flexible, Implantable, Bio-medical Devices, Scalable Manufacturing, and Advanced Material Innovations.


Session #1:   E-Textiles: Energy devices, sensors, and their integration towards wearable healthcare and soft robotics
Chair: Prof. Hyun-Joong Chung, University of Alberta, Canada


1) “System Design Considerations for Textile-Based Electronics”, Prof. Jess Jur, North Carolina State University, USA (Invited)

2) “Super-elastic multi-material fibers for healthcare, advanced textiles and soft robotics”, Prof. Fabien Sorin, École polytechnique fédérale de Lausanne, Swiss (Invited)

3) “A Solution for Wearable Electronics: Electroless Nickel-Immersion Gold Coatings for Stretchable Conductors and e-Textiles”, Prof. Tricia Breen Carmichael, University of Windsor, Canada (Invited)

4) “Electronic textile for skin-mountable biomedical device”, Prof. Kyung-In Jang, Daegu Gyeongbuk Institute of Science and Technology, Korea (Invited)

5) “Force myography: a step forward”, Prof. Carlo Menon, Simon Fraser University, Canada (Invited)

6) “Elastomer/Textile Composites in Wearable Electronics and in Normothermic Ex-Vivo Organ Perfusion Devices”, Prof Hyun-Joong Chung, University of Alberta, Canada (Invited)

Session #2:   Flexible Bio-medial Sensors/Electronics
Chair: Prof. Tae-il Kim, Sungkyunkwan University, South Korea

1) [Point-of-use flexible sensors for health and environmental applications: assessment of motor skills and chemical exposure, ], [Prof. Tina Ng], [Electrical and Computer Engineering, University of California, San Diego  USA] (Invited)

2) [Imperceptible sensor foils for soft electronics and machines], [Prof. Martin Kaltenbrunner], [Linz Institute of Technology, Johannes Kepler University, Austria] (Invited)

3) [Soft Sensing Devices and Technologies for Wearables, Robotics and Prosthetics Systems], [Prof. Benjamin Tee], [Department of Materials Science and Engieering, National University of Singapore (NUS), Singapore] (Invited)

4) [Wearable and Implantable Devices ‘On the Go’], [Prof. Canan Dagdeviren], [Media lab, MIT, USA] (Invited)

5) [Unconventional Bio-integrated Electronics towards Human-Machine Interface], [Department of Electrical and Electronic Engineering, Prof. Ki Jun Yu], [Yonsei University, Korea] (Invited)

6) [Self-assembled flexible neural probes for stable neural activity recordings], [Prof. Ying Fang], [CAS Key Laboratory for Biomedical Effects of Nanomaterials & Nanosafety, China] (Invited)

Session #3:  Emerging Materials and Devices for Advanced Soft Implantable Systems
Chair: Prof. Hui Fang, Northeastern University, USA

1. Microelectrode Arrays for Large Scale Clinical Mapping: Electrochemical and Density Considerations, Prof. Shadi A. Dayeh, Department of Electrical and Computer Engineering, University of California San Diego (Invited)

2. Flexible injectable probe for chronic and acute stress monitoring, Prof. Tae-il Kim, School of Chemical Engineering, Sungkyunkwan University (SKKU), (Invited)

3. Flexible, Hybrid Optoelectronic Implants for Neural Interfaces, Prof. Wen Li, Department of Electrical and Computer Engineering, Michigan State University, (Invited)

4. Flexible Microsystems for On-Body Sensing and Measuring Tissue Integrated Sensors, Prof. Michael A. Daniele,  Department of Electrical and Computer Engineering, Joint Department of Biomedical Engineering, NC State University (Invited)

5. Sticker-like electronics (Sticktronics) for wearable biomedical devices, Prof. Chi Hwan Lee, Weldon School of Biomedical Engineering, School of Mechanical Engineering, Department of Speech, Language, and Hearing Sciences (by Courtesy), Purdue University (Invited)

6. Multimaterial multifunctional fiber-based neural interfaces, Prof. Xiaoting Jia, Bradley Department of Electrical and Computer Engineering, Virginia Tech (Invited)

Session #4:  Stretchable electronics and energy devices
Chair: Prof. Pooi See Lee, Nanyang Technical University, Singapore
  1. Adding a new sensing dimension to soft sensors: from the skin to below the skin, Prof. Sheng Xu, University of California, San Diego
  1. Recent Progress on Highly Compliant Polymer Electronic and Electromechanically Responsive Materials and Device Explorations, Prof. Qibing Pei, University of California, Los Angeles 
  1. Powered Platform for All-stretchable Electronics, Prof. Unyong Jeong, POSTECH, South Korea 
  1. Flexible, stretchable and healable electronics, Prof. Fabio Cicoira, Department of Chemical Engineering, Polytechnique Montréal, Canada 
  1. Fully Rubbery Stretchable Electronics and Integrated Devices, Prof. Cunjiang Yu, Univ of Houston
6. Stretchable and deformable materials and devices for wearable technology, Prof Pooi See Lee
Session #5: Flexible and Stretchable Electronics Technologies and Sensors
Chair: Prof. Matti Mäntysalo, Tampere University of Technology, Finland

1. Stretchable free-form circuits based on conventional electronic assembly and polymer processing technologies, Prof. Jan Vanfleteren, IMEC and Ghent University, Ghent, BELGIUM (Invited)

2. Flexible Printed Organic Electronics and their IoT Sensor Applications, Prof. Shizuo Tokito, Research Centor for Organic Electronics, Yamagata University, Japan (Invited)

3. Facile Fabrication of Highly Soft Tactile Sensor based on Porous Sponge with Geometry Effect on Sensing Characteristics, Prof. Geng Yang, State Key Laboratory of Fluid Power and Mechatronic Systems, School of Mechanical Engineering, Zhejiang Univ. Hangzhou, China (Invited)

4. Printed and Flexible NTC Thermistors Suitable for On-Skin Temperature Monitoring, Dr. Terho Kololuoma, VTT Technical Research Centre of Finland (Invited)

5. Performance of fully printed ultra-thin inverter for on-skin biosignal measurements, Mr. Mika-Matti Laurila, Tampere University, Finland (Invited)

Session #6: From the Laboratory to the Manufacturing Floor: Scalable Processes for Flexible Electronics

Chairs: Dr. Scott Miller, NextFlex and Dr. Benjamin Leever, AFRL, USA

1. Next Generation Process for Electronics, Dr. Jaons Veres, PARC (Invited)

2. Materials & Multi-Scale Patterning Approaches to Inspire Printed Electronics Solutions, Dr. Adam Cook, Sandia National Lab (Invited)

3. Printed Hyrbid Electronics: From Printed Interconnects to Multi-Layer Printed Circuitization and 3D Hybrid Electronics, Dr. Daniel Hines, Laboratory for Physical Sciences (Invited)

4. Material Challenges for Printed Electronics in the Microwave Domain, Prof. Craig Armiento, University of Massachusetts Lowell (Invited)

5. Essential Technologies for the Future of Scalable FHE and Energy Device Additive Manufacturing, Prof. Devin MacKenzie, University of Washington (Invited)

6. A Manufacturing Case Study: Design & Fabrication of an FHE Programmable Microcontroller, Mr. Wilfried Bair,  NextFlex (Invited)

Session #7: Material & Process Innovations in Flexible Printed Electronics
Chairs: Prof. Jie Zhang, Jiangnan University, China and Prof. Gyoujin Cho, Sunchon National University, South Korea

1. “Development of flexible tactile sensor using hybrid manufacturing technologies” Prof. Dr. Toshihide Kamata, AIST, Japan (Invited)

2. “The Impact of polymer electrolytes on the performace and longevity of solid flexible supercapacitors”, Prof. Keryn Lian, University of Toronto, Canada (Invited)

3. “Nanomaterials for printed electronics”, Dr. Patrick Melafant, NRC, Canada (Invited)

4. “Fabricating high performance FACsPb(I/Br)3 perovskite films through printing tehnologies”Prof. Frank Peng, Wuhan University of Technology, China (Invited)

5. “R2R gravure printed IGZO based rectenna for NFC sensor tags”, Dr. Yeonsu Joung, Sunchon National University, South Korea (Invited)

6. “Fabrication of High-Performance Soft Composites 3D Electronics by Hybrid Modes with Direct Ink Writing” Prof. Yu Liu, Jiangnan University, China (Invited)