Prospective authors should recommend a technical category based on the broad description areas above when submitting their papers. The papers should be prepared using the given IEEE abstract template in two-page and submitted as PDF files using the online submission system. Preference for oral or poster presentation format needs to be indicated. All IFETC2022 submissions will be subject to IEEE-EDS standard review processes and IEEE conference publishing guidelines. Papers must clearly state the purpose of the work, the manner and degree to which it advances the art accompanied by proper references, and specific new results that have been obtained with clear experimental conditions and their significance. Accepted papers presented at the meeting will be published in the IFETC 2022 proceedings and available on IEEE Xplore.In addition, the authors of a selected number of high-impact presented papers will be invited to submit an extended version of the same for consideration of publication in IEEE Journal on Flexible Electronics (J-FLEX). All such submissions must comply with J-FLEX author-guidelines and will be subjected to the standard IEEE and J-FLEX review and publication policy.
Technical Scope
Materials, Devices and Processing (MDP):flexible/stretchable transistors and other passive/active electronic devices (e.g. antennas, diodes, memories, synapses, …) in inorganic, organic and nanostructure materials, including materials, device structures, simulation and modeling, processing, and characterization; devices on plastic, paper and bio-degradable substrates are solicited; conventional and unconventional micro/nano fabrication processes (e.g. photolithography, nanoimprinting, soft lithography, etc.) and mechanical structure design for ultra-flexible/stretchable devices, and fiber electronics are of interest; material selection, processes and device architectures for high speed and low power flexible transistors are solicited; device issues and solutions for circuit integration such as reliability, power constraints, scaling and yield.
Energy Harvesting and Storage (EHS): all kinds of flexible/stretchable energy harvesting technologies, including photovoltaic, piezoelectric, triboelectric, electromagnetic, and thermoelectric ones, and flexible/stretchable energy storage devices such as batteries and supercapacitors; material design, novel fabrication techniques, and device structure design to achieve high efficiency energy harvesting and high energy/power density with good durability; integration of energy harvesting, storage and power management units for wearable or e-skin systems.
Emissive and Reflective Displays (ERD): advances of various emissive and reflective flexible displays, including OLED, QLED, LCD, electrophoretic, electrowetting, MEMS, and other novel technologies; light modulation or emission devices, active matrix backplanes, novel fabrication techniques, mechanical stress management and thin-film encapsulation; thin-film transistor arrays, micro/mini LED arrays, interconnections and related materials towards stretchable and deformable displays are of interest; in-display function integration for human-machine interaction, fingerprint, biometric sensing, wireless communication and energy harvesting.
Sensors, Actuators and Bioelectronics (SAB): flexible sensors and actuators, with particular emphasis on new materials and device concepts, and multi-device integration for e-skin, wearable health, internet-of-everything and robot applications; physical, chemical, and biological sensors based on electrical, electrochemical, mechanical and optical principles; flexible integrated photonics for sensing; bio‐electronic interface, biomedical sensing and neural interfaces based on organic and inorganic devices.
Circuits and Systems (CAS): designs and techniques and circuit/system levels to leverage the basis at material/device levels towards making flexible functional systems for real applications; design and implementation of analog and digital circuit blocks in flexible thin-film transistors with aging and process variation compensation; ultra-low power integrated circuit design, including sensing/wireless interface, MCU and power management, for wearable or implantable applications; circuit and system designs based on hybrid device technologies to compensate aging or process variations with flexible devices.
Emerging Applications (EAP): system implementations for all kinds of potential applications, including wearable health and therapeutics, human–machine interaction, intelligent robotics, structural health monitoring, lab-on-a-chip and internet-of-everything; hybrid integration of multi-materials and components and flexible/stretchable encapsulation techniques for realizing various integration concepts, including e-textiles, e-skin, active-matrix biomedical sensors, in-mold electronics and smart-packaging; design and implementation of novel bio-inspired integrated systems.
Important Dates
Submission Deadline: May 31, 2022
Notification of Acceptance: June 25, 2022
Final Paper Submission Deadline: July 06, 2022
Early Bird Registration Deadline: July 12, 2022
Paper Submission
The IEEE template requires to be used for submission of the extended abstract. Use the attached IEEE abstract template. PDF file needs to be submitted to the site below.
IFETC2022-extended-abstract-template
Abstract submission site: https://edas.info/N29518 or https://ifetc2022.edas.info
The authors require to go on their EDAS account and click on the upload final button under their account. Please only submit the 2-page extended abstract.
IEEE Conference ID code: 53656X
Creating your PDF eXpress Account
Log in to the IEEE PDF eXpress TM site
First-time users should do the following:
- Select the New Users – Click Here link.
- Enter the following:
- 53656X for the Conference ID
- your email address
- a password
- Continue to enter information as prompted.
An Online confirmation will be displayed and an email confirmation will be sent verifying your account setup.
Previous users of PDF eXpress need to follow the above steps, but should enter the same password that was used for previous conferences. Verify that your contact information is valid.