ANDESCON 2024
September 11 to 13 | Cusco - Perú
Paraninfo Universitario UNSAAC (Mantas 117, Cusco 08002)
ANDESCON is the biannual Technical and Scienti Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The twelfth edition of this IEEE event will be held in the wonderful city of Cusco, Perú. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.
The accepted and presented papers will be sent to IEEExplore and indexed by Scopus.
Important Dates
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Deadline Paper Submission |
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New Deadline Paper Submission
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Hard Deadline Paper Submission
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Notification of Acceptance |
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Camera Ready Submission & Author Registration |
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September 11th,2024 |
Conference Opening |
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September 13th,2024 |
Conference Closing |
More information for Authors:
Keynote speaker
PhD. Tom Coughlin
2024 IEEE President
Prof. Dr. Ing. Falko Dressler
Technische Universitat Berlin
PhD. Farnoosh Rahmatian
Nugrid Power Corp
M.sc. Ignacio Castillo Velazquez
Autonomous University of Mexico City Mexico
PhD. Manuel Delgado-Restituto
Institute of Microelectronics of Seville
PhD. Tom Coughlin
2024 IEEE President
PhD. Dejan Milojicic
Technologist of HP Labs
Prof. Dr. Ing. Falko Dressler
Technische Universitat Berlin
PhD. Farnoosh Rahmatian
Nugrid Power Corp
PhD. Manuel Delgado-Restituto
Institute of Microelectronics of Seville
Paraninfo Universitario UNSAAC (Mantas 117, Cusco, Perú)
Organized by
Organize
Seccion Perú del IEEE
Auspice
IEEE Consejo Andino
Universidad Nacional San Antonio Abad del Cusco (UNSAAC)
Technical Sponsors
Office
IEEE Perú (Lima, Perú):
Av. República de Chile 284, Jesús María 15072
Lima, Perú
Telephone exchange
+51 933 129 554
Write to us
informes@ieee.org.pe
andescon2024@ieee.org