ANDESCON is the biannual Technical and Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The twelfth edition of this IEEE event will be held in the wonderful city of Cusco, Perú. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.
Journal DYNA
Selected excellent papers will be recommended for review in the journal DYNA, Ingeniería e Industria, edited by the Federation of Associations for Industrial Engineers of Spain. DYNA is currently included in the Science Citation Index Expanded of Web of Science, with impact factor of 0.781, and Scopus.