Call for Papers 2022

ANDESCON is the biannual Technical and Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The eleventh edition of this IEEE event will be held in the wonderful city of Barranquilla in Colombia. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to meet and present the developments and technological advances that move the Andean region countries.

IEEE ANDESCON 2022 will be held in person if COVID-19 emergency allows that. In that case, a special room for remote presentations will be enabled.

The conference covers both theoretical and practical issues related to, but not limited to:

  • Circuits, Systems and Electron Devices
  • Communications
  • Computational Intelligence
  • Computer and Software Engineering
  • Education in Engineering
  • Engineering in Medicine and Biology
  • Industrial Electronics
  • Power and Energy
  • Robotics and Automation Systems
  • Signal Processing & Aerospace and Electronic Systems
  • Smart Cities and Smart Mobility
  • Systems and Control
  • Technology & Engineering Management

Paper Submission

The articles must be submitted in digital format (PDF) through the paper submission page. Papers must be written in English. Papers must use the IEEE conference format. The maximum length is six (6) pages per article including illustrations and references. Each paper should indicate appropriateness for the scope of the Conference, originality and quality of the technical content, whole organization and writing style. Papers submitted to IEEE Andescon 2022 will follow a double-blind review process. This means that authors of the submitted papers will need to remove all information revealing their identity (this includes author names, affiliations, and references to sponsoring agencies). Accepted papers will be published in the conference proceedings and submitted for inclusion in the IEEE Xplore Digital Library. All previous Andescon editions that meet the SCOPUS guidelines have been included in this index.

For each accepted paper, at least one of the authors must register and present the paper at the conference; no-show paper will not be submitted for inclusion in IEEE Xplore. All papers will be cross‐examined using anti‐plagiarism automated software tools.

Use the following link to submit your paper.

Templates

Microsoft Word
  • A4 (DOC, 30KB)
LaTex
Overleaf
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