IEEE Electron Devices Kolkata Conference (EDKCON 2024)

Track 1: Emerging Devices and Technology

Biodegradable and Flexible Electronic Devices; Electron Devices for “More than Moore”, 2D and devices on low-dimensional materials, Neuromorphic and approximate computing devices, Spintronic and magnetic devices, Steep-slope devices, Quantum computing devices, Cryogenic Devices, Topological materials and devices, and phase transitions transistors, Compound Semiconductors and High-Speed Devices, Wearable electronics. Wide bandgap and ultra-wide bandgap semiconductors, Power devices, High Performance III-V, III-Nitride and Si, SiGe devices for mm-wave to THz.Device and circuits for 5G and 6G, Power device technologies for micro and mm-wave

Track-2: Analog/Digital/ Mixed Mode Circuits and Systems

Analog and Mixed Signal Circuits and Systems, Communications Circuits and Systems, Sensory Circuits and Systems, Nonlinear Systems and Circuit Theory, Visual Signal Processing and Communications Education in Circuits and Systems, Beyond CMOS: Nanoelectronics and Hybrid Systems Integration Digital Integrated Circuits and Systems, Power and Energy Circuits and Systems, Biomedical Circuits and Systems Neural Networks and Neuromorphic Engineering, Digital Signal Processing, Multimedia Systems and Applications, Low power circuits and system, high speed circuits and systems. Control electronics for Quantum Computing

Track 3: Memory Devices and Technology

3D memory technologies, Conventional memories, Emerging memories for neural networks and AI/ML applications, Computing-in-memory, new memory hierarchy, Volatile memories such as static and dynamic random-access memories, Flash memory, Spintronics based memories, Domain wall and skyrmions based memory, Resistive random-access memory (ReRAM or RRAM), Memristors, Phase Change Memory (PCM), Conductive bridging random-access memory (CBRAM), Ferro-electric random-access memory (FeRAM), Metal Oxide Resistive Memory (OxRAM), Optoelectronic memories, Photonics based memories, Organic memory devices, Three-dimensional integrated memory, Modelling and numerical analysis, Device characterization and fabrication, Scalability, integration and nano-structuring of memory devices, Reliability analysis of emerging memory devices, Emerging conventional and unconventional memories)

Track-4: Device Modeling and Simulations

Multiscale simulation with hybrid techniques, TCAD and benchmarking, Atomistic simulation, Compact models for device/system technology co-optimizations, Alternative computing device modeling, modeling of emerging devices, Material and interconnect modeling, Advanced packaging and 3D integration modeling, Device modeling for photonics, sensor computing, RF device and circuits, and MEMS

Track 5: Nano-electronic Devices and Technology

Novel nanomaterials and devices, Nanobiotechnology, Nanomaterials for energy conversion, Green nanotechnology, Nano Mechanics, Carbon Nanotubes emitters, Biological applications of nanoparticles, Nano Fabrication and Metrology, Nano Heat Transfer and Energy Information Technology, Nano Sensors, Actuators and Systems Nanobionics, Nanofluidics and Bio Chips, Organic Electronics, nanowires and nanosheets

Track 6: Advance Processing and characterizations

Advanced process integration schemes and (applications-driven) scaling approaches, Device/System technology co-optimization, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, Interconnects (TSV, BEOL, Frontside and Backside connectivity), BEOL compatible transistors, CMOS platform technologies & opportunities

Track 7: Device and System Reliability

Reliability of devices and systems for biomedical, automotive, and aerospace, Reliability of FEOL/MEOL/BEOL, latch‐up and ESD, Design for reliability and variability-aware design, Robustness and security of electronic circuits and systems, Reliability of cryogenic devices for future quantum computing applications, Noise characterization of device and system, Reliability of biomedical devices, circuits and systems, Degradation mechanisms of emerging memories, Reliability of devices, circuits, and systems for more-than-Moore, reliability of power devices

Track 8: Optoelectronic Devices and circuits, Displays and Imagers

Topological optoelectronics and photonics, Optoelectronic integration, Heterogeneous optoelectronic integration, Single-photon devices, Holographic devices and displays, Luminescent devices-based perovskites and quantum dots, Intelligent Image Sensors, PV systems, Solar cells, Displays, and imagers for augmented or virtual reality, Imagers with an unconventional spectral bandwidth, high sensitivity, or high time-resolution

Track 9: Sensor and MEMS

Bio-sensor, ISFET, Ph Sensor, gas sensors, Flexible devices for wearable applications, Intelligent sensors with embedded AI/ML, Sensors and devices for human-machine interface, MEMS for Internet of Things, Bio-electronic interfaces and implantable devices, Energy harvesting and storage devices, Flexible devices for wearable applications

Track 10: Intelligent Electronic Device, Circuit, and System

Devices/ Circuits/systems/ Tools/Platforms for AI, Artificial intelligence computing, Advanced neural network design, Neuromorphic processors, Deep learning algorithms, ML algorithms, Hardware accelerators, Hardware design for AI, Emerging applications of AI

Track 11: VLSI System Design and Security (VSDS) :

Structured and custom design methodologies, microprocessors/micro-architectures for performance and low power, embedded processors, analog/digital/mixed-signal systems, NoC, power and temperature aware designs, hardware security, cryptography, watermarking, and IP protection, TRNG and security-oriented circuits, PUF circuits.

Track 12: Computer-Aided Design for VLSI and Verification (CAD-VLSI):

Hardware/software co-design, logic and behavioral synthesis, simulation and formal verification, physical design, signal integrity, power and thermal analysis, and statistical approaches.