We welcome new and unpublished contributions on:
Interconnects design & technologies
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- High-speed channels, backplanes, SerDes, memory, DDR interfaces
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- Interconnect and transceiver co-design, equalization
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- Signal & power integrity issues
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- Jitter, noise
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- High-frequency interconnects, packages, antennas-in-package
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- Novel/unconventional interconnect technologies
Manufacturing and measurement
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- Manufacturing, testing, reliability
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- Measurement techniques
Packaging and integration
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- Advanced packaging, 3D integration
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- Heterogeneous integration
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- Design of interconnects and packages
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- Quantum systems: interconnection & packaging aspects
Modeling and simulation
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- Modeling, simulation, computer-aided design
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- Thermal, mechanical, multiphysics modeling
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- ML and AI-based approaches to interconnect and packaging problems
Download the Call for Papers (PDF)