We welcome new and unpublished contributions on:

Interconnects design & technologies

    • High-speed channels, backplanes, SerDes, memory, DDR interfaces

    • Interconnect and transceiver co-design, equalization

    • Signal & power integrity issues

    • Jitter, noise

    • High-frequency interconnects, packages, antennas-in-package

    • Novel/unconventional interconnect technologies

Manufacturing and measurement

    • Manufacturing, testing, reliability

    • Measurement techniques

Packaging and integration

    • Advanced packaging, 3D integration

    • Heterogeneous integration

    • Design of interconnects and packages

    • Quantum systems: interconnection & packaging aspects

Modeling and simulation

    • Modeling, simulation, computer-aided design

    • Thermal, mechanical, multiphysics modeling

    • ML and AI-based approaches to interconnect and packaging problems

Download the Call for Papers (PDF)

Special Issue of IEEE Transactions on Components, Packaging and Manufacturing Technology

Select EPEPS papers will be invited for a full-length submission to a special issue of IEEE Transactions on Components, Packaging and Manufacturing Technology.