Important Notice

The International and Local Conference Organizing Committee of ICPADM2021 is monitoring the impact of COVID-19 disease crisis worldwide and consequently evaluating the situation of ICPADM2021. With the circumstances relating to COVID-19 changing day by day, our priority is to ensure the health and safety of our participants and staff. We will provide new information about the conference from time to time. Until then, we recommend not to book any travel arrangement for the conference. Thank you in advance for your understanding and your continued support. We hope you and your dear ones will remain safe.


The 2021 International Conference on the Properties and Applications of Dielectric Materials (ICPADM) is the 13th meeting of this conference series. The IEEE Dielectrics and Electrical Insulation Society (DEIS) undertook sponsorship of the conference after the first meeting in June 24-28, 1985.
ICPADM has a long history. So far the conference venues have been in Xi’an, China (1985); Beijing, China (1988); Tokyo, Japan (1991); Brisbane, Australia (1994); Seoul, Korea (1997); Xi’an, China (2000); Nagoya, Japan (2003); Bali, Indonesia (2006); Harbin, China (2009); Bangalore, India (2012); Sydney, Australia (2015), Xi’an, China (2018).
ICPADM2021 will be held in Johor Bahru, Malaysia organized by Universiti Teknologi Malaysia, Institute of High Voltage and High Current and sponsored by the IEEE DEIS.
All accepted papers for ICPADM2021 will be included in the IEEE Xplore Digital Library (subject to approval from the IEEE Technical Committee)

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