Important Notice

Under the present COVID-19 circumstances, the International Advisory Committee and the Local Organizing Committee of ICPADM2021 have decided to change the format of ICPADM2021 to a fully virtual conference.
We thank all the contributors who had uploaded their abstracts to the conference, despite the very difficult situation. We would also like to announce that we are also accepting NEW submissions in the form of a full 4-page manuscript. We encourage current as well as other contributors to submit their manuscripts for review by March 31, 2021, April 30, 2021. 


The 2021 International Conference on the Properties and Applications of Dielectric Materials (ICPADM) is the 13th meeting of this conference series. The IEEE Dielectrics and Electrical Insulation Society (DEIS) undertook sponsorship of the conference after the first meeting in June 24-28, 1985.
ICPADM has a long history. So far the conference venues have been in Xi’an, China (1985); Beijing, China (1988); Tokyo, Japan (1991); Brisbane, Australia (1994); Seoul, Korea (1997); Xi’an, China (2000); Nagoya, Japan (2003); Bali, Indonesia (2006); Harbin, China (2009); Bangalore, India (2012); Sydney, Australia (2015), Xi’an, China (2018).
ICPADM2021 will be held in Johor Bahru, Malaysia organized by Universiti Teknologi Malaysia, Institute of High Voltage and High Current and sponsored by the IEEE DEIS.
All accepted papers for ICPADM2021 will be included in the IEEE Xplore Digital Library (subject to approval from the IEEE Technical Committee)

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