The 2021 International Conference on the Properties and Applications of Dielectric Materials (ICPADM) is the 13th meeting of this conference series. The IEEE Dielectrics and Electrical Insulation Society (DEIS) undertook sponsorship of the conference after the first meeting in June 24-28, 1985.

ICPADM has a long history. So far the conference venues have been in Xi’an, China (1985); Beijing, China (1988); Tokyo, Japan (1991); Brisbane, Australia (1994); Seoul, Korea (1997); Xi’an, China (2000); Nagoya, Japan (2003); Bali, Indonesia (2006); Harbin, China (2009); Bangalore, India (2012); Sydney, Australia (2015), Xi’an, China (2018).

ICPADM2021 will be held in Johor Bahru, Malaysia organized by Universiti Teknologi Malaysia, Institute of High Voltage and High Current and sponsored by the IEEE DEIS.

Call for Abstracts