Thank you for your recent participation at the 2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM).
In addition, we have emailed the certificate of participation to all presenting and non-presenting participants. If you have not received the certificate, please do not hesitate to contact us at email@example.com.
We are also pleased to announce that the following papers have been selected as ‘Best Paper’ for ICPADM2021:
Electric Field Distribution in HVDC Cable Joint in Non-Stationary Conditions
Gilbert Teyssedre (LAPLACE, CNRS, Paul Sabatier University, France); Thi Thu Nga Vu (Electric Power University, Hanoi, Vietnam); Séverine Le Roy (CNRS, France)
Harmonic Currents Generated by MV Modular Converters and Thermal Insulation Aging of Polymeric Cables
Matthew Bosworth (Florida State University, USA); Gian Carlo Montanari (FSU, USA); Mischa Steurer and Lu Wang (Florida State University, USA); Riddhi Ghosh (University of Bologna, Italy); Patrick Lewis (Hepburn and Sons LLC, USA)
Study of High Voltage Connectors for Coaxial Cables Used in Kicker Applications at CERN
Dimitrios Kontelis, Laurent Ducimetiere, Thomas Kramer, Luc Sermeus, Tobias Stadlbauer and Pavlina Trubacova (CERN, Switzerland)
Effect of Trap Property on Charge Transport Parameters of BaTiO3/Polyimide Nanocomposites
Jiasheng Ru (Xi’an Jiaotong University, China); Daomin Min (Xi’an Jiaotong University & Waseda University, Japan); Shengtao Li (Xi’an Jiaotong University, China); George Chen (University of Southampton, United Kingdom)
Vacuum DC Flashover Performance Improvement by CF4 Radio Frequency Capacitively Coupled Plasma
Chenxu Wang (Xi’an Jiaotong University, China); Xingyu Chen, Bo Zhang and Yuhao Sun (Xi’an Jiaotong University, China); Ya’nan Peng (Xi’an Jiaotong University, China); Guan-Jun Zhang (State Key Laboratory, Xi’an Jiaotong University, China)
Under the present COVID-19 circumstances, the International Advisory Committee and the Local Organizing Committee of ICPADM2021 have decided to change the format of ICPADM2021 to a fully virtual conference.
We thank all the contributors who had uploaded their abstracts to the conference, despite the very difficult situation. We would also like to announce that we are also accepting NEW submissions in the form of a full 4-page manuscript. We encourage current as well as other contributors to submit their manuscripts for review by
March 31, 2021, April 30, 2021.
The 2021 International Conference on the Properties and Applications of Dielectric Materials (ICPADM) is the 13th meeting of this conference series. The IEEE Dielectrics and Electrical Insulation Society (DEIS) undertook sponsorship of the conference after the first meeting in June 24-28, 1985.
ICPADM has a long history. So far the conference venues have been in Xi’an, China (1985); Beijing, China (1988); Tokyo, Japan (1991); Brisbane, Australia (1994); Seoul, Korea (1997); Xi’an, China (2000); Nagoya, Japan (2003); Bali, Indonesia (2006); Harbin, China (2009); Bangalore, India (2012); Sydney, Australia (2015) and Xi’an, China (2018).
ICPADM2021 will be held in Johor Bahru, Malaysia organized by Universiti Teknologi Malaysia, Institute of High Voltage and High Current and sponsored by the IEEE DEIS.
All accepted papers for ICPADM2021 will be included in the IEEE Xplore Digital Library (subject to approval from the IEEE Technical Committee).
All presenting and non-presenting participants of ICPADM2021 will be entitled to 18 CPD hours for the 3-day conference, as approved by Board of Engineers Malaysia (BEM).
‘Best Paper Award’ will be announced during the closing ceremony of ICPADM2021.