Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)

16-17 November, 2023  at SEMI World Hdqtrs, Milpitas, CA USA

Note: REPP-2023 is planned as a hybrid event, with both in-person and virtual participation via WebEx; make your choice during Registration.

Review the Advance Program and the three Pre-Symposium Tutorials (on demand).

Welcome to the fourth year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging in the context of heterogeneous integration. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Invited Plenary and Keynote Talks

Reliability of Molded Packages under High Field Conditions
Prof. Susanna Reggiani, Bologna Univ.
Reliability Challenges in Silicon-based MEMS Technologies
Prof. Ashwin Seshia, Cambridge University
Reliability Assessment for Heterogeneously Integrated Packages
Prof. Ganesh Subbarayan, Purdue University
SiPh Reliability and Qualification
Angelo Miele, Cisco Systems Inc.
Test Processes for JEDEC-compatible Heterogeneous Packaging Technology for Integrated Photonics
Sylwester Latkowski, Eindhoven University of Technology
Intelligent Reliability: IRel 4.0
Willem van Driel, Signify
Recent Advances in Electromigration and Theromomigration Study
Prof. Xuejun Fan, Lamar University
Reliability Evaluation Boards for Embedded Power MOSFETs
Dr. Rene Poelma, Nexperia


You may access videos and slides of many REPP presentations from REPP 2020, from REPP 2021, and from REPP 2022.

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REPP Invitation

Confirmed Plenary Talks

Reliability of Molded Packages under High Field Conditions
Prof. Susanna Reggiani, Bologna University

Reliability Challenges in Silicon-based MEMS Technologies
Prof. Ashwin Seshia, Cambridge University

SiPh Reliability and Qualification
Angelo Miele, Cisco Systems

Reliability Assessment for Heterogeneously Integrated Packages
Ganesh Subbarayan, Purdue University