Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)
Theme: Reliability for Advanced Semiconductor Packaging

November 7-8, 2024, hosted at Purdue University, West Lafayette, Indiana USA

Note: REPP-2024 is planned as a hybrid event, with both in-person and virtual participation via WebEx.

Download the Call for Presentations

Confirmed Speakers at REPP:

Thermal Management of Hybrid Integrated Lasers in Si Photonics
David Coenen, imec		 HALT and TC Reliability of QFN Assemblies with and without Urethane Coating
Reza Ghaffarian, NASA JPL
Mario Gonzalez Mechanical Integrity of Hybrid Bonding
Oguzhan Orkut Okudur, imec		 Reliability of Bonded Interface Materials for Power Electronics
Sreekant Narumanchi, Ph.D., National Renewable Energy Laboratory
Reliability Problems of Optoactive Materials in LED Packaging
Prof. Gabor Harsanyi, Budapest University of Technology and Economics 		Cryogenic CMOS Technologies for Quantum Computing Systems
Alexander Grill, imec
Reliability Modeling of Electronics Cooling Systems in Data Centers
Srikanth Rangarajan, Binghamton Univ 		Reliability and Availability of Novel Data Center Cooling Systems
Prof. Patrick McCluskey, University of Maryland
… and many more! See the full listing

Sponsors