Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh)

12-13 November, 2020   Silicon Valley, CA USA

Note: REPP-2020 will be a virtual Symposium

Welcome to the website of Silicon Valley’s new Symposium. This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Please download the Advance Program. Note that additional talks may be added; check back for updated content.

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Featured REPP Talks

    (Soon to be structured into sessions. Click, for details)
Fan-Out Wafer Level and Panel Level Package Reliability Overview

New Results on Electromigration Modeling: A Departure from Blech’s Theory

Keynotes

(preliminary – check back for updates)
Emerging Reliability Challenges: Solutions from Architecture to Layout for Large SoCs and 3DICs, Norman Chang, Ansys Fellow and Chief Technologist at Semiconductor BU, ANSYS, Inc. (more details)

Reliability Challenges in Advanced Packaging, Subramanian S. Iyer, Center for Heterogeneous Integration and Performance Scaling, School of Engineering, UCLA (more details)

Highly Reliable Silicon Photonics DWDM Modules, Ranjani Muthiah, Associate Vice President for Quality & Reliability, Inphi Corp. (more details)

Evolution of Data Center Optics Packaging Technology and Reliability Challenges, Dr. Omer Khayam, Google Technical Infrastructure (more details)

Electronics Quality and Reliability for Critical Applications that Adopt New Technologies and Designs, Alan Lucero, Director for Global Quality, Reliability and Regulatory Standardization, Intel Corp. (more details)

Silicon Photonics: State-Of-The-Art, Challenges, and Future Requirements, Vipul Patel, Senior Technologist, Cisco (more details)

Sponsors:

Electronics Packaging SocietyThe Santa Clara Valley chapter of the Electronics Packaging Society, with technical co-sponsorship from the IEEE Electronics Packaging Society.

Advance Program

Registration is now open.

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