Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh)

11-12 November, 2021   Silicon Valley, CA USA

Note: REPP-2021 is planned to be a hybrid event, with both in-person and virtual participation via WebEx

Welcome to the second year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

You may access videos and slides of many REPP presentations from 2020.

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Call for Abstracts now posted

We encourage you to submit a proposed talk for REPP’21. Download the Call for Abstracts; circulate it to others in our profession.

Keynotes

REPP will have four Keynote presentations covering leading directions and thrusts in this field. Please follow instructions in the Call for Abstracts to propose a topic.

You can view on-demand videos of the 2020 Keynote Talks

Sponsor:

IEEE Electronics Packaging Society Electronics Packaging Society

with technical co-sponsorship/support from The Santa Clara Valley (Silicon Valley) Chapters:
Electronics Packaging Society Photonics Society Reliability Society

Last Year's Advance Program

Registration will open during August.

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