Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)

9-10 November, 2022  at Texas Instruments, Santa Clara, CA USA

Note: REPP-2022 is planned to be a hybrid event, with both in-person and virtual participation via WebEx

Welcome to the third year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.View the Call for Abstracts and submit a proposal.

You may access videos and slides of many REPP presentations from REPP 2020 and REPP 2021.

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REPP Invitation

Confirmed Keynote Talks

Reliability Outlook and Challenges for Monolithic SiPh Applications from a Foundry Viewpoint
Dr. Byoung Woon Min, Deputy Director of Reliability Engineering, GlobalFoundries

Heterogeneous Integration: Packaging Opportunities and Challenges – A Reliability Perspective
Prof. Suresh Sitaraman, Georgia Institute of Technology

Reliability Challenges of Advanced Silicon Photonics Devices
Dr. Kristof Croes, imec

Additive Manufacturing Technologies for Custom-made Electronic Packaging – Processes and Reliability
Prof. Ricky Lee, HKUST