Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh)

12-13 November, 2020   Silicon Valley, CA USA

Welcome to the website of Silicon Valley’s new Symposium. This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Please download the Call for Presentations. Your abstract is due by 15 September 2020.
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Santa Clara Valley chapters of the following IEEE Societies:
Electronics Packaging Society Photonics Society Reliability Society

with technical co-sponsorship from the IEEE Electronics Packaging Society.