Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh)

12-13 November, 2020   Silicon Valley, CA USA

Note: REPP-2020 will be a virtual Symposium

Welcome to the website of Silicon Valley’s new Symposium. This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

For updated information, subscribe to our IEEE ListServ Dlist

Advance Program now posted

The REPP Program Team has structured the final program, and we invite you to review it to select the Keynotes and sessions that will be most useful to you in your career. Please view it and print it out or download it as a PDF.

You may also download a one-page PDF of the Advance Program, to circulate to other professionals.


Reliability Challenges for the Aerospace Sector and the Use of Commercial Off-The-Shelf Components (COTS), Chris Bailey, University of Greenwich (more details)

Emerging Reliability Challenges: Solutions from Architecture to Layout for Large SoCs and 3DICs, Norman Chang, Ansys Fellow and Chief Technologist at Semiconductor BU, ANSYS, Inc. (more details)

Reliability Challenges in Advanced Packaging, Subramanian S. Iyer, Center for Heterogeneous Integration and Performance Scaling, School of Engineering, UCLA (more details)

Reliability Challenges for Electronics and Photonics Packaging for Deep Space, Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology (more details)

Highly Reliable Silicon Photonics DWDM Modules, Ranjani Muthiah, Associate Vice President for Quality & Reliability, Inphi Corp. (more details)

Evolution of Data Center Optics Packaging Technology and Reliability Challenges, Dr. Omer Khayam, Google Technical Infrastructure (more details)

Electronics Quality and Reliability for Critical Applications that Adopt New Technologies and Designs, Alan Lucero, Director for Global Quality, Reliability and Regulatory Standardization, Intel Corp. (more details)

Silicon Photonics: State-Of-The-Art, Challenges, and Future Requirements, Vipul Patel, Senior Technologist, Cisco (more details)


The Santa Clara Valley (Silicon Valley) Chapters:
Electronics Packaging Society Photonics Society Reliability Society
with technical co-sponsorship from the IEEE Electronics Packaging Society. Electronics Packaging Society

Advance Program

Registration is now open.

Join our IEEE ListServ Dist to hear updates about REPP.