Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)
16-17 November, 2023 at SEMI World Hdqtrs, Milpitas, CA USA
Note: REPP-2023 is planned as a hybrid event, with both in-person and virtual participation via WebEx; make your choice during Registration.
|Welcome to the fourth year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging in the context of heterogeneous integration. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.
Invited Plenary and Keynote Talks
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Confirmed Plenary Talks
Reliability of Molded Packages under High Field Conditions
Reliability Challenges in Silicon-based MEMS Technologies
SiPh Reliability and Qualification
Reliability Assessment for Heterogeneously Integrated Packages