Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)
Theme: Reliability for Advanced Semiconductor Packaging

November 7-8, 2024, hosted at Purdue University, West Lafayette, Indiana USA

Note: REPP-2024 is planned as a hybrid event, with both in-person and virtual participation via WebEx.

Welcome to the Fifth year of this new Symposium from the IEEE Electronics Packaging Society. This major symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging in the context of heterogeneous integration. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Invitation to Submit an Abstract

Please download our Call for Presentations (PDF)
Submit your Proposal by email to our Program Chair

You may access videos and slides of many REPP presentations from REPP 2020, from REPP 2021, from REPP 2022, and from REPP 2023.

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REPP Invitation

Confirmed Plenary Talks