REPP Sponsors

Electronics Packaging Society

We thank our sponsor!

The REPP Symposium is sponsored by the IEEE’s Electronics Packaging Society.

Heterogeneous Integration Roadmap The primary EPS thrust for establishing REPP is the development of the IEEE Heterogeneous Integration Roadmap; the 2022 edition of the updated Roadmap is available now, for download.


Publicity Supporters:

REPP thanks these five chapters for providing publicity for this year’s Symposium:
IEEE SCV Reliability Chapter Singapore Joint EDS/EPS/Rel Chapter SCV Photonics Chapter IEEE EPS SCV Chapter Electron Devices Chapter