We thank our sponsors!
The REPP Symposium is sponsored by the IEEE’s Electronics Packaging Society.
The primary EPS thrust for establishing REPP is the development of the IEEE Heterogeneous Integration Roadmap; the 2021 edition of the updated Roadmap should be available at the time of REPP, or shortly afterwards. REPP will feature a 2-hour Workshop with presentations from several of the Roadmap’s Technical Working Groups.
REPP thanks these five chapters for co-sponsoring this year’s Symposium: