REPP Sponsors

Electronics Packaging Society

We thank our sponsors!

The REPP Symposium is sponsored by the IEEE’s Electronics Packaging Society.


Heterogeneous Integration Roadmap The primary EPS thrust for establishing REPP is the development of the IEEE Heterogeneous Integration Roadmap; the 2021 edition of the updated Roadmap should be available at the time of REPP, or shortly afterwards. REPP will feature a 2-hour Workshop with presentations from several of the Roadmap’s Technical Working Groups.

Co-sponsors:

REPP thanks these five chapters for co-sponsoring this year’s Symposium:
IEEE SCV Reliability Chapter Singapore Joint EDS/EPS/Rel Chapter SCV Photonics Chapter IEEE EPS SCV Chapter Electron Devices Chapter