The following Plenary Presentations have not yet been assigned a day/time but are confirmed.

Random Failure Reduction: Strategy for Advanced Semiconductor Device Production

Dr. Antai Xu, Senior Director of Reliability Engineering, Xilinx Corp.
ABSTRACT: As Si processes enter nano and atomic scales, integrating semiconductor devices into SiPs has become an important technology to extend product roadmaps. On the center stage of this progress, product reliability performance provides a measuring criterion to validate, and eventually qualify, the integrity of these products. In more recent integration technologies, such as 2.5D and 3D packaging, highly accelerated and dynamic reliability testing conditions are attempted. These tests, occurring side-by-side with engineering development, have greatly sped up materials selection and process optimization, as well as providing guidance for better reliability performance over time. In addition, studying reliability failures fulfills the need to predict product field risk. In many cases, these analyses define the key parameter for reliability monitor during production, and in some case, also help customers to understand the boundary conditions of their product’s mission profile. In this talk, the following points will be addressed:
— Bathtub curve, Wear out and Margin in the advanced SiP products
— Lifetime model, test to failure, and reliability specifications
— Very long manufacturing cycle time, random failure, redundancy
— Thermo management, hotspots and acceleration
Dr. Antai Xu has been the Senior Director of Reliability Engineering at Xilinx Corporation since 2015. He is leading the company’s NPI qualifications in all 16 nm and 7 nm technologies, and has worked on various challenges in 2.5D & 3D Si integration. Prior to joining Xilinx, he served as the Division Head of Backend Quality and Reliability TSMC, where he led the reliability testing and qualification of the two breakthrough technologies, namely CoWoS & InFO. Both technologies were successfully released to production with remarkable impact to the semiconductor products roadmap in the late stage of Moore’s Law. Dr. Xu’s broader experiences also include 30 years of R&D, Materials Processing, Reliability as well as Executive Management in the industry of Aerospace Electronics, Magnetic Storage, O/MEMS, and Bio/DNA testing systems. He received his Ph.D. from Purdue University in Materials Science, and M.S. from Georgetown University in Physics.

Do You Know What’s Hiding in Your Supply Chain?

Dr. Kitty Pearsall, EPS President-Elect
ABSTRACT: The electronics packaging industry electronics has shifted away from monolithic systems that were prevalent in the IT dominated space, to the consumer-focused realm where compute has become pervasive. This results in more complex supply chain dynamics. Key factors for this shift include product/application complexity as well as global complexity; geographical and political diversity; supply chain disruptions (e.g., pandemics, raw material shortages, climate change); and supply chain development (e.g., development and support for new materials.).
OEM, OSATs, and Foundries all have supply chain choices. Regardless of what choices are made, the interaction between each and their suppliers varies. There is multiple sourcing, single sourcing, and sole sourcing regardless of facility type. When each entity works with their suppliers, and their suppliers work with their network of suppliers, the supply chain can become a very elongated and complex network that can be a barrel-shaped supply chain network, diamond shaped supply chain structure, or a hybrid of the different models. Disruptions of any sort can impact the OEM, OSATs, and foundries across the electronic packaging industry.
Disruptions that have had significant impact will be discussed in this presentation. A common theme prevails: the lack of transparency. An example of the listed disruptions (below), its impact, and risk mitigation will be presented.
• Natural Disasters (hurricanes, typhoons, tsunamis, pandemics and other)
• Manufacturing Capacity
• Design and Development Changes
• Raw Material Shortages
• Counterfeit parts
• Mergers and Acquisitions Political/Personnel Unrest Disruptions (strikes, geo-political)
• Accidents
It has been reported (2020) that only a few companies are/have been investing in their supply chain visibility. However, visibility is still limited by most of those that have been investing, as they don’t see across their entire supply chain. More significant is that greater than 50% of companies polled had no supply chain visibility at all. To mitigate the challenges and impacts suffered by most suppliers during disruptions, the supply chain management process must be optimized. Fragmented, unconnected supply chains must be replaced by dynamic, smart, integrated, E2E (end to end) supply chains (via IoT). Visibility and traceability in an E2E IOT supply chain is critical to providing a resilient supply chain that is flexible and can adapt to impacts/issues in real time.
Kitty Pearsall received the BS degree in Metallurgical Engineering (1971) from University of Texas at El Paso. Kitty received the MS and PhD degree in Mechanical Engineering and Materials from the University of Texas Austin in 1979 and 1983 respectively. She worked for IBM for 41 years. In 2005 Kitty was appointed an IBM Distinguished Engineer and was elected to the IBM Academy of Technology. Kitty was a process consultant and subject matter expert working on strategic initiatives impacting component qualification and end quality of procured commodities. As part of the Integrated Supply Chain, she engaged with WW teams implementing cross-brand, cross commodity processes/products that delivered high quality/high reliability product.
Kitty received many IBM Outstanding Technical Achievement Awards; holds 12 US patents; and 8 published disclosures. She has numerous internal publications as well as 22 external publications in her field. Kitty is a licensed Professional Engineer (Texas since 1993). Kitty was awarded the Women in Technology Fran E. Allan Mentoring Award (2006) in recognition of her people development both in and outside of IBM. Currently she is President of Boss Precision Inc. and works as an independent consultant. This has included a one-year engagement with Shainin Corporation.
Kitty has been an active member in IEEE for 31 years as well as an EPS/CPMT member for 28 years. Kitty has volunteered (27 yrs.) at ECTC as a member of the ECTC Manufacturing Technology Committee (1993-2013) and the ECTC PDC Chair since 2006. During Kitty’s 16 years on the EPS Board of Governors, Kitty has served in many roles: Member at Large, Strategic Awards Director, VP of Education, Director of WW Chapter Programs, and Chair of the EPS Field Award Committee. Currently she is the EPS President Elect.

Making Digital Twins Work

Prof. Kouchi Zhang, University of Delft
ABSTRACT: Driven by the ever-increasing societal needs for digitization and intelligence, such as autonomous driving, Manufacture 4.0, “Smart-X”, and “AI in all”, the demands for mission-critical electronics components and systems are growing fast. To realize “performance and lifetime on demand” for those mission critical electronics, Digital Twin (DT) technology will play a more and more important role. DT consists of mainly 3 parts: physical products in real space, digital products in virtual space, and connections of data and information that tie the virtual and real product together. Starting from the definition of DT for mission-critical electronics, this talk will focus on the major success factors of developing a reliable virtual twin via multi-scale and multi-physics simulation and optimization, covering the whole product creation, qualification and application conditions. Some challenges for future developments will also be highlighted.
Dr. G.Q. Zhang is an IEEE Fellow, chair professor for Micro/Nanoelectronics System Integration and Reliability at Delft University of Technology (TUD). His research interests cover multi-level heterogeneous system integration and packaging; multi-physics and multiscale modeling and optimization of micro/nanoelectronics; digital twin and designing for reliability; wide-bandgap semiconductor sensors and components; SSL technology; and their applications mainly in healthcare, energy and mobility.
He chaired the Strategic Research Agenda of “More than Moore” for Europe’s technology platform for micro/nanoelectronics; served as co-chair of the academic council of the Dutch national innovation program “Point-One” on Micro/nanoelectronics and embedded systems; he was the founding person for MEMSLand, the NL national MEMS research consortium. Before becoming full-time professor at TUD, he worked for NXP Semiconductors as Senior Director of Technology Strategy until 2009, and Philips Research Fellow until May 2013. He was also a part-time professor at the Technical University of Eindhoven since 2001 and part-time professor of TUD since 2005. He is secretary-general of IEEE ITRW (International Technology Roadmap of Wide bandgap power semiconductors).

Silicon Photonics: Integration, Reliability Challenges and Future Requirements

Nan Wang, Sr. Director, Technology and Quality, Supply Chain Operations, Cisco Systems, Inc.
ABSTRACT: The accelerated pace of digital transformation drives significant growth in internet data traffic and connectivity through a faster optical network. Silicon Photonics Technology is a key enabler for scaling next-generation networking architectures. It offers compelling benefits in high-bandwidth, low-power, low-cost pluggable optics, Digital Coherent Optics (DCO), and paves the road for the next transition to co-packaged optics. At the same time, the design, productization, and scaling of Silicon Photonics technology have their complexity and challenges. In this talk, we will take a closer look into the SiPho integration, reliability, testing, and supply chain eco-system:
— Heterogeneous integration of electrical and optical process technologies is critical for low-cost, high-volume Si-Photonics packaging.
— Convergence of ASIC and Optics requires advanced packaging technologies and an integration architecture to address both component- and system-level requirements.
— Standardization in Reliability/Qualification and Innovative Design for Testability will be key factors for success.
— Most importantly, the strong momentum and roadmap behind Silicon Photonics are driving the need for a more mature supply chain eco-system to achieve economies of scale and harvest the full benefit of this technology.

Nan Wang has been with Cisco Systems for 21 years, where he serves as Sr. Director in the Technology and Quality organization within Cisco’s global Supply Chain Operations. He leads the Component Quality and Technology Group, with focus on strategic component technology development for next generation products across Cisco. In recent years, his team has been focusing on component technology innovations, such as Silicon Photonics and 2.5D/3D ICs, to enable the next generation of the networking applications and accelerate the digital transformation.