Technical Program Committee

IEEE IUS 2019, 6-9 October 2019, SEC, Glasgow, Scotland, UK

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IEEE IUS 2019 Technical Program Committee

Medical Ultrasonics

Vice-Chair: Alfred C. H. Yu, University of Waterloo, Canada

  1. Ayache Bouakaz, INSERM, France
  2. Bajram Zeqiri, National Physical Laboratory, UK
  3. Brian Fowlkes, University of Michigan, US
  4. Caterina Gallippi, University of North Carolina, US
  5. Charles A. Cain, University of Michigan, US
  6. Chih-Kuang Yeh, National Tsing Hua University, Taiwan
  7. Chris de Korte, Radboud University Medical Center, The Netherlands
  8. Damien  Garcia, CREATIS, France
  9. Elisa Konofagou, Columbia University, US
  10. Emad Ebbini, University of Minnesota, US
  11. Georg Schmitz, Ruhr-Universität Bochum, Germany
  12. George Kapodistrias, Samsung Research America, US
  13. Guy Cloutier, University of Montreal, Canada
  14. Hairong Zheng, Shenzhen Institutes of Advanced Technology, China
  15. Helen Mulvana, University of Glasgow, UK
  16. Hervé Liebgott, CREATIS, France
  17. Hideyuki Hasegawa, University of Toyama, Japan
  18. Hiroshi Kanai, Tohoku University, Japan
  19. James Greenleaf, Mayo Clinic, US
  20. James Wiskin, QT Ultrasound Inc., US
  21. Jan Dhooge, Catholic University of Leuven, Belgium
  22. Jean-Yves Chapelon, INSERM, France
  23. Jeff Ketterling, Riverside Research , US
  24. Jeremy Dahl, Stanford University, US
  25. Jianwen Luo, Tsinghua University, China
  26. Jian-yu Lu, University of Toledo, US
  27. John Hossack, University of Virginia, US
  28. Jonathan Mamou, Riverside Research , US
  29. Jørgen Arendt Jensen, Technical University Denmark , Denmark
  30. Kai E. Thomenius, Massachusetts Institute of Technology, US
  31. Kang Kim, University of Pittsburgh, US
  32. Kathy Ferrara, Stanford University, US
  33. Kathy Nightingale, Duke University, US
  34. Keith Wear, Food and Drug Administration, US
  35. Kendall Waters, Silicon Valley Medical Instruments, US
  36. Kullervo Hynynen, University of Toronto, Canada
  37. Larry Mo, GE Global Research, US
  38. Lasse Løvstakken, Norwegian University of Science and Technology, Norway
  39. Lori Bridal, University Pierre and Marie Curie, France
  40. Magnus Cinthio, Lund University, Sweden
  41. Marie Muller, North Carolina State University, US
  42. Mark Borden, University of Colorado Boulder, US
  43. Marvin Doyley, University of Rochester, US
  44. Massimo Mischi, Einhoven University of Technology, The Netherlands
  45. Matthew F. Bruce, University of Washington, US
  46. Matthew W. Urban, Mayo Clinic, US
  47. Michael Kolios, Ryerson University, Canada
  48. Michael Oelze, University of Illinois, US
  49. Mickael Tanter, INSERM, France
  50. Mike Averkiou, University of Washington, US
  51. Mingxi Wan, Xi’an Jiaotong University, China
  52. Mostafa Fatemi, Mayo Clinic College of Medicine, US
  53. Nico de Jong, Erasmus Medical Centre, The Netherlands
  54. Nobuki Kudo, Hokkaido University, Japan
  55. Olivier Couture, CNRS at Physics for Medicine, France
  56. Pai Chi Li, National Taiwan University, Taiwan
  57. Paul A. Dayton, University of North Carolina/NCSU, US
  58. Peter Hoskins, University of Edinburgh, UK
  59. Piero Tortoli, University of Florence, Italy
  60. Ralf Seip, SonaCare Medical, LLC, US
  61. Roberto Lavarello, Pontificia Universidad Católica del Perú, Peru
  62. Roger J. Zemp, University of Alberta, Canada
  63. Shigao Chen, Mayo Clinic, US
  64. Stas Emelianov, Georgia Institute of Technology and Emory University School of Medicine, US
  65. Steven Freear, University of Leeds, UK
  66. Stuart Foster, University of Toronto, Canada
  67. Svetoslav Nikolov, BK Ultrasound, Denmark
  68. Thanasis Loupas, Philips Ultrasound, US
  69. Ton van der Steen, Erasmus Medical Centre, The Netherlands
  70. Wilko G. Wilkening, Siemens Medical Solutions , US
  71. William D. O’Brien, University of Illinois, US
  72. Yonina Eldar, Weizmann Institute of Science, Israel

Sensors, NDE & Industrial Applications

Vice-Chair: Erdal Oruklu, Illinois Institute of Technology

  1. Bernhard Tittmann, Pennsylvania State University
  2. David Greve, Carnegie Mellon University
  3. Donald McCann, Seadrill
  4. Donald E.  Yuhas, Industrial Measurement Systems
  5. Edward Haeggstrom, University of Helsinki
  6. Jacqueline Hines, Applied Sensor R&D Corporation
  7. Jafar Saniie, Illinois Institute of Technology
  8. James Blackshire, Air Force Research Laboratory
  9. James Friend, UCSD
  10. Jennifer Michaels, Georgia Institute of Technology
  11. Jiromaru Tsujino, Kanagawa University
  12. Joel Harley , University of Utah
  13. John F.  Vetelino, University of Maine
  14. Kentaro Nakamura, Tokyo Institute of Technology
  15. Lawrence W. Kessler, Sonoscan Inc.
  16. Mario Kupnik, Technische Universität Darmstadt
  17. Nishal Ramadas, Elster Instromet
  18. Patrick Johnston, NASA Langley Research Center
  19. Paul Wilcox, University of Bristol
  20. Ramazan Demirli, Villanova University
  21. Robert C.  Addison, Rockwell Science Center
  22. Roman Maev, University of Windsor
  23. Walter Arnold, Fraunhofer Institute for NDT
  24. William Wright, University College Cork

Physical Acoustics

Vice-Chair: Koen W.A. van Dongen, Delft University of Technology, the Netherlands

  1. Alex Maznev, MIT, USA
  2. Amit Lal, Cornell University, USA
  3. Andreas Mayer, HS Offenburg – Univ. of Applied Sciences, Gengenbach, Germany
  4. Anne Bernassau, Heriot Watt University, UK
  5. Charles Courtney, University of Bath, UK
  6. Dave Feld, Broadcom Ltd, USA
  7. Eun Sok Kim, University of Southern California, USA
  8. István A. Veres, Qorvo Inc., USA
  9. Jan Brown, JB Consulting, USA
  10. Ji Wang, Ningbo University, China
  11. Jiun-Der Yu, Qualcomm Technologies, Inc., USA
  12. John Larson, Broadcom Ltd, USA
  13. Jörg Wallaschek, Leibniz Universität Hannover, Germany
  14. Kimmo Kokkonen, Qorvo, Germany
  15. Margaret Lucas, University of Glasgow, Scotland, UK
  16. Masaya Takasaki, Saitama University, Japan
  17. Minoru Kuribayashi Kurosawa, Tokyo Institute of Technology, Japan
  18. Robert Thalhammer, Qualcomm, Germany
  19. Robert J. McGough, MSU, USA
  20. Takahiko Yanagitani, Waseda University, Japan
  21. Takefumi Kanda, Okayama University, Japan
  22. Vincent Laude, FEMTO-ST / CNRS, France
  23. Yook-Kong Yong, Rutgers University, USA
  24. Yun Jing,  North Carolina State University, USA

Microacoustics-SAW, BAW & MEMS

Vice-Chair: Shuji Tanaka, Tohoku University, Japan

  1. Amelie Hagelauer, University of Erlangen-Nuremberg, Germany
  2. Ben Abbott, Skyworks Solutions, Inc., USA
  3. Gerhard Fischerauer, Universität Bayreuth, Germany
  4. Hagen Schmidt, Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden), Germany
  5. Hiroyuki Nakamura, Skyworks Solutions, Inc., Japan
  6. Jan Kuypers, Blickfeld GmbH, Germany
  7. Jidong Dai, Murata Electronics North America, Inc. , USA
  8. Jyrki Kaitila, Broadcom Ltd, Germany
  9. Karl Wagner, RF360 Europe GmbH, Germany
  10. Ken-ya Hashimoto, Chiba University, Japan
  11. Leonhard Reindl, Albert-Ludwigs-Universität Freiburg, Germany
  12. Marc Solal, Qorvo, Inc, USA
  13. Masanori Ueda, TAIYO YUDEN CO., LTD., JAPAN
  14. Mauricio Pereira da Cunha, University of Maine, USA
  15. Maximilian Pitschi, RF360 Europe GmbH, Germany
  16. Michio Kadota, Tohoku University, Japan
  17. Natalya Naumenko, National University of Science and Technology “MISIS”, Russia
  18. Omar Elmazria, Université de Lorraine, France
  19. Paul Bradley, Broadcom Ltd, USA
  20. Rich Ruby, Broadcom Ltd, USA
  21. Robert Weigel, University of Erlangen-Nurember, Germany
  22. Robert  Aigner, Qorvo, Inc.
  23. Ryo Nakagawa, Murata Manufacturing Co., Ltd., Japan
  24. Sergei Zhgoon, National Research University “MPEI” (Moscow Power Engineering Institute), Russia
  25. Shogo Inoue, Qorvo, Inc, USA
  26. Sunil Bhave, Purdue University, USA
  27. Sylvain Ballandras, frec|n|sys SASU, France
  28. Tao Han, Shanghai Jiao Tong University, China
  29. Tuomas Pensala, VTT Technical Research Centre of Finland, Finland
  30. Ventsislav Yantchev, Chalmers University of Technology, Sweden

Transducers & Transducer Materials

Vice-Chair: Omer Oralkan, North Carolina State University, USA

  1. Alessandro Savoia, Universita degli Studi Roma Tre, Italy
  2. Anne-Christine Hladky, Institut Supérieur d’Electronique et du Numerique, France
  3. Arif Sanli Ergun, TOBB University, Turkey
  4. Charles Emery, Ulthera Inc., USA
  5. Christine Démoré, University of Glasgow, UK
  6. Christopher Daft, River Sonic Solutions, USA
  7. David Cowell, University of Leeds, UK
  8. Franck Levassort, Francois-Rabelais University of Tours, France
  9. Ho-yong Lee, Ceracomp Co., Ltd, Korea
  10. Jeremy Brown, Dalhousie University, Canada
  11. Jian Yuan, ALS Shanghai, China
  12. Loriann Davidsen, Philips Healthcare , USA
  13. Lynn Ewart, NUWC, USA
  14. Nicolas Felix, Vermon SA, France
  15. Qifa Zhou, University of Southern California, USA
  16. Richard O’Leary, University of Strathclyde, UK
  17. Sandy Cochran, University of Glasgow, UK
  18. Shujun Zhang, University of Wollongong, Australia
  19. Stefan Rupitsch, Friedrich-Alexander University, Germany
  20. Susan Trolier-McKinstry, Pennsylvania State University, USA
  21. Tomas Gomez, CSIC, Madrid, Spain
  22. Valsala Kurusingal, Thales Australia, Australia
  23. Wallace Smith, Office of Naval Research, USA
  24. Wei Ren, Xi’an Jiaotong University, China
  25. Weibao Qiu, Shenzhen Institutes of Advanced Technology, China
  26. Xiaoning Jiang, North Carolina State University, USA
  27. Yongrae Roh, Kyungpook National University, Korea